21/09/2026
Meet the engineers building Japan's #1 FinTech platform. 🇯🇵
RSVP here: https://global.cake.me/paypay-fb-w2
PayPay株式会社's first-ever hiring event in Kuala Lumpur is happening October 3rd — and you'll hear directly from the people building it.
🇲🇾Clement Ong — Senior Engineering Manager, PayPay Corporation
🇮🇩Matias Setiano — Senior Backend Engineer, PayPay Card Corporation
🇯🇵Misa Taguchi — Talent Acquisition, PayPay Corporation
Here's what's on the agenda 👇
💻 Behind the Code: Engineers, Challenges & Real-World Solutions
A panel discussion on the technical realities of building at PayPay's scale — 75 million users and counting.
🌏 Going Global: Living and Working in Japan
Real talk on the transition to Japan — culture, career growth, and what international professionals should actually expect.
🤝 Direct networking and access to job opportunities
Small, invite-only room. Talk to the engineers and TA team who'll actually be reviewing applications — then stick around for the networking session after.
📅 3 October 2026 (Saturday) | 2:00 – 5:00 PM (doors open 1:30 PM)
📍 Common Ground Bukit Bintang, KL
🗣️ Event is fully conducted in English
Open to software engineers and product development professionals with 5+ years of experience.
Register now — spots are limited and you’ll get exclusive invitation once shortlisted by PayPay: https://global.cake.me/paypay-fb-w2